- Specs
- Chipsets
Phone chipsets
LexzyTech Specs covers 78 phone chipsets from 7 makers (MediaTek, Qualcomm, Unisoc, Apple, Samsung, Huawei and Google), used in 168 phones. The most used is the Dimensity 6300, in 11 phones. The newest flagship chip here is the Kirin 9035. Each chipset page explains its power, what it runs well and what the phones with it offer.
MediaTek chipsets 28
| Chipset | Class | Process | Year | Phones |
|---|---|---|---|---|
| Dimensity 6360 Max | mid-range | 6 nm | 2026* | 1 |
| Dimensity 6400 | mid-range | 6 nm | 2026* | 1 |
| Dimensity 7100 | mid-range | 6 nm | 2026* | 3 |
| Dimensity 7300 Elite | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7360 Max | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7400 Elite | mid-range | 4 nm | 2026* | 2 |
| Dimensity 7400 Ultimate | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7400 Ultra | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7450X | mid-range | 4 nm | 2026* | 1 |
| Dimensity 9400+ | flagship | 3 nm | 2026* | 1 |
| Dimensity 9500 | flagship | 3 nm | 2026* | 1 |
| Dimensity 9600 Pro | flagship | 2 nm | 2026* | 2 |
| Dimensity 9600M | flagship | 3 nm | 2026* | 2 |
| Helio G100 | mid-range | 6 nm | 2026* | 3 |
| Helio G200 | mid-range | 6 nm | 2026* | 2 |
| Helio G200 Ultimate | mid-range | 6 nm | 2026* | 1 |
| MTK Dimensity 7025 | mid-range | 6 nm | 2026* | 1 |
| Dimensity 6300 | mid-range | 6 nm | 2025* | 11 |
| Dimensity 8300 | flagship | 4 nm | 2025* | 2 |
| Helio G100 Ultimate | mid-range | 6 nm | 2025* | 3 |
| Helio G81 | entry-level | 12 nm | 2025* | 3 |
| Dimensity 6100+ | mid-range | 6 nm | 2024* | 1 |
| Helio G91 | entry-level | 12 nm | 2024* | 1 |
| Dimensity 7050 | mid-range | 6 nm | 2023* | 3 |
| Helio G36 | entry-level | 12 nm | 2023* | 1 |
| Helio G99 | mid-range | 6 nm | 2023* | 5 |
| Helio G85 · MT6768 | entry-level | 12 nm | 2020 | 3 |
| Helio P22 · MT6762 | entry-level | 12 nm | 2019* | 1 |
Qualcomm chipsets 21
| Chipset | Class | Process | Year | Phones |
|---|---|---|---|---|
| QCM6690 | not yet classed | 4 nm | 2026* | 1 |
| Snapdragon 6 Gen 4 | not yet classed | 4 nm | 2026* | 1 |
| Snapdragon 6 Gen 5 · SM6850 | upper mid-range | 4 nm | 2026* | 3 |
| Snapdragon 6s Gen 2 · SM4450-AF | mid-range | 4 nm | 2026* | 1 |
| Snapdragon 6s Gen 3 | mid-range | 6 nm | 2026* | 1 |
| Snapdragon 6s Gen 4 · SM6435-AA | mid-range | 4 nm | 2026* | 3 |
| Snapdragon 8 Elite Extreme Gen 6 · SM8975 | flagship | 2 nm | 2026* | 3 |
| Snapdragon 8 Elite Gen 5 for Galaxy · SM8850 | flagship | 3 nm | 2026* | 2 |
| Snapdragon 8 Elite Gen 6 | flagship | 2 nm | 2026* | 1 |
| Snapdragon 8 Gen 5 · SM8845 | flagship | 3 nm | 2026* | 1 |
| Snapdragon 4 Gen 2 · SM4450 | mid-range | 4 nm | 2025* | 1 |
| Snapdragon 6 Gen 3 · SM6475-AB | mid-range | 4 nm | 2025* | 3 |
| Snapdragon 7 Gen 3 · SM7550 | mid-range | 4 nm | 2025* | 2 |
| Snapdragon 7 Gen 4 · SM7750-AB | upper mid-range | 4 nm | 2025* | 5 |
| Snapdragon 7s Gen 3 · SM7635 | mid-range | 4 nm | 2025* | 3 |
| Snapdragon 7s Gen 4 · SM7635 | mid-range | 4 nm | 2025* | 3 |
| Snapdragon 8 Elite for Galaxy | flagship | 3 nm | 2025 | 1 |
| Snapdragon 8 Elite Gen 5 · SM8850-AC | flagship | 3 nm | 2025* | 10 |
| Snapdragon 8 Gen 3 · SM8650-AB | flagship | 4 nm | 2025* | 1 |
| Snapdragon 8s Gen 4 | flagship | 4 nm | 2025 | 4 |
| Snapdragon 8 Elite | flagship | 3 nm | 2024 | 5 |
Unisoc chipsets 12
| Chipset | Class | Process | Year | Phones |
|---|---|---|---|---|
| Unisoc SC9863A | entry-level | 22 nm | 2026* | 3 |
| Unisoc T610 | entry-level | 12 nm | 2026* | 2 |
| Unisoc T616 | entry-level | 12 nm | 2026* | 1 |
| Unisoc T7100 | not yet classed | — | 2026* | 3 |
| Unisoc T7300 | mid-range | 6 nm | 2026* | 1 |
| Unisoc T8200 | mid-range | 6 nm | 2026* | 3 |
| Unisoc T8300 | mid-range | 6 nm | 2026* | 1 |
| Unisoc T615 | entry-level | 12 nm | 2025* | 3 |
| Unisoc T620 | mid-range | 12 nm | 2025* | 3 |
| Unisoc T7200 | entry-level | 12 nm | 2025* | 1 |
| Unisoc T7250 | entry-level | 12 nm | 2025* | 3 |
| Unisoc T606 | entry-level | 12 nm | 2022* | 2 |
Apple chipsets 5
| Chipset | Class | Process | Year | Phones |
|---|---|---|---|---|
| Apple A20 Pro | flagship | 2 nm | 2026* | 2 |
| Apple A19 | flagship | 3 nm | 2025* | 2 |
| Apple A19 Pro | flagship | 3 nm | 2025 | 3 |
| Apple A18 | flagship | 3 nm | 2024* | 2 |
| Apple A18 Pro | flagship | 3 nm | 2024* | 2 |
Samsung chipsets 5
| Chipset | Class | Process | Year | Phones |
|---|---|---|---|---|
| Exynos 1480 | mid-range | 4 nm | 2026* | 1 |
| Exynos 1610 | entry-level | — | 2026* | 1 |
| Exynos 1680 | upper mid-range | 4 nm | 2026* | 1 |
| Exynos 2500 | flagship | 3 nm | 2026* | 1 |
| Exynos 2600 for Galaxy · SM8850 | flagship | 3 nm | 2026* | 1 |
Huawei chipsets 4
| Chipset | Class | Process | Year | Phones |
|---|---|---|---|---|
| Kirin 8020 | upper mid-range | 7 nm | 2026* | 1 |
| Kirin 9010S | upper mid-range | 7 nm | 2026* | 1 |
| Kirin 9035 | flagship | 5 nm | 2026 | 1 |
| Kirin T93 / Kirin T93A | not yet classed | — | 2026* | 1 |
Google chipsets 3
* Year of the first phone on LexzyTech Specs with that chip (its own launch year is not published by our sources). Classes are our estimate from each chip's design, not benchmark scores.
Quick answers
Which phone chipset is used most on LexzyTech Specs?
The Dimensity 6300 by MediaTek, in 11 phones.
Which chipset makers are covered?
MediaTek (28), Qualcomm (21), Unisoc (12), Apple (5), Samsung (5), Huawei (4) and Google (3).
How are chipsets classed?
Flagship, upper mid-range, mid-range or entry-level, from our 1-5 ratings where we rated the chip, otherwise our estimate from its design (cores, clock speed, graphics). They are not benchmark scores.