- Mga Detalye
- Mga Chipset
Mga chipset ng telepono
Ang LexzyTech Specs ay nagtuturo ng 78 na chipset ng telepono mula sa 7 na gumagawa (MediaTek, Qualcomm, Unisoc, Apple, Samsung, Huawei at Google), ginagamit sa 168 na telepono. Pinakagamit ay ang Dimensity 6300, sa 11 na telepono. Pinabagong flagship chip dito ay ang Kirin 9035. Bawat pahina ng chipset ay naglalarawan sa kanyang kapangyarihan, ano ang tumatakbo nang mahusay at ano ang mga telepono nito ay nag-aalok.
Mga chipset ng MediaTek 28
| Chipset | Klase | Proseso | Taon | Mga Telepono |
|---|---|---|---|---|
| Dimensity 6360 Max | mid-range | 6 nm | 2026* | 1 |
| Dimensity 6400 | mid-range | 6 nm | 2026* | 1 |
| Dimensity 7100 | mid-range | 6 nm | 2026* | 3 |
| Dimensity 7300 Elite | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7360 Max | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7400 Elite | mid-range | 4 nm | 2026* | 2 |
| Dimensity 7400 Ultimate | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7400 Ultra | mid-range | 4 nm | 2026* | 1 |
| Dimensity 7450X | mid-range | 4 nm | 2026* | 1 |
| Dimensity 9400+ | flagship | 3 nm | 2026* | 1 |
| Dimensity 9500 | flagship | 3 nm | 2026* | 1 |
| Dimensity 9600 Pro | flagship | 2 nm | 2026* | 2 |
| Dimensity 9600M | flagship | 3 nm | 2026* | 2 |
| Helio G100 | mid-range | 6 nm | 2026* | 3 |
| Helio G200 | mid-range | 6 nm | 2026* | 2 |
| Helio G200 Ultimate | mid-range | 6 nm | 2026* | 1 |
| MTK Dimensity 7025 | mid-range | 6 nm | 2026* | 1 |
| Dimensity 6300 | mid-range | 6 nm | 2025* | 11 |
| Dimensity 8300 | flagship | 4 nm | 2025* | 2 |
| Helio G100 Ultimate | mid-range | 6 nm | 2025* | 3 |
| Helio G81 | entry-level | 12 nm | 2025* | 3 |
| Dimensity 6100+ | mid-range | 6 nm | 2024* | 1 |
| Helio G91 | entry-level | 12 nm | 2024* | 1 |
| Dimensity 7050 | mid-range | 6 nm | 2023* | 3 |
| Helio G36 | entry-level | 12 nm | 2023* | 1 |
| Helio G99 | mid-range | 6 nm | 2023* | 5 |
| Helio G85 · MT6768 | entry-level | 12 nm | 2020 | 3 |
| Helio P22 · MT6762 | entry-level | 12 nm | 2019* | 1 |
Mga chipset ng Qualcomm 21
| Chipset | Klase | Proseso | Taon | Mga Telepono |
|---|---|---|---|---|
| QCM6690 | not yet classed | 4 nm | 2026* | 1 |
| Snapdragon 6 Gen 4 | not yet classed | 4 nm | 2026* | 1 |
| Snapdragon 6 Gen 5 · SM6850 | upper mid-range | 4 nm | 2026* | 3 |
| Snapdragon 6s Gen 2 · SM4450-AF | mid-range | 4 nm | 2026* | 1 |
| Snapdragon 6s Gen 3 | mid-range | 6 nm | 2026* | 1 |
| Snapdragon 6s Gen 4 · SM6435-AA | mid-range | 4 nm | 2026* | 3 |
| Snapdragon 8 Elite Extreme Gen 6 · SM8975 | flagship | 2 nm | 2026* | 3 |
| Snapdragon 8 Elite Gen 5 for Galaxy · SM8850 | flagship | 3 nm | 2026* | 2 |
| Snapdragon 8 Elite Gen 6 | flagship | 2 nm | 2026* | 1 |
| Snapdragon 8 Gen 5 · SM8845 | flagship | 3 nm | 2026* | 1 |
| Snapdragon 4 Gen 2 · SM4450 | mid-range | 4 nm | 2025* | 1 |
| Snapdragon 6 Gen 3 · SM6475-AB | mid-range | 4 nm | 2025* | 3 |
| Snapdragon 7 Gen 3 · SM7550 | mid-range | 4 nm | 2025* | 2 |
| Snapdragon 7 Gen 4 · SM7750-AB | upper mid-range | 4 nm | 2025* | 5 |
| Snapdragon 7s Gen 3 · SM7635 | mid-range | 4 nm | 2025* | 3 |
| Snapdragon 7s Gen 4 · SM7635 | mid-range | 4 nm | 2025* | 3 |
| Snapdragon 8 Elite for Galaxy | flagship | 3 nm | 2025 | 1 |
| Snapdragon 8 Elite Gen 5 · SM8850-AC | flagship | 3 nm | 2025* | 10 |
| Snapdragon 8 Gen 3 · SM8650-AB | flagship | 4 nm | 2025* | 1 |
| Snapdragon 8s Gen 4 | flagship | 4 nm | 2025 | 4 |
| Snapdragon 8 Elite | flagship | 3 nm | 2024 | 5 |
Mga chipset ng Unisoc 12
| Chipset | Klase | Proseso | Taon | Mga Telepono |
|---|---|---|---|---|
| Unisoc SC9863A | entry-level | 22 nm | 2026* | 3 |
| Unisoc T610 | entry-level | 12 nm | 2026* | 2 |
| Unisoc T616 | entry-level | 12 nm | 2026* | 1 |
| Unisoc T7100 | not yet classed | — | 2026* | 3 |
| Unisoc T7300 | mid-range | 6 nm | 2026* | 1 |
| Unisoc T8200 | mid-range | 6 nm | 2026* | 3 |
| Unisoc T8300 | mid-range | 6 nm | 2026* | 1 |
| Unisoc T615 | entry-level | 12 nm | 2025* | 3 |
| Unisoc T620 | mid-range | 12 nm | 2025* | 3 |
| Unisoc T7200 | entry-level | 12 nm | 2025* | 1 |
| Unisoc T7250 | entry-level | 12 nm | 2025* | 3 |
| Unisoc T606 | entry-level | 12 nm | 2022* | 2 |
Mga chipset ng Apple 5
| Chipset | Klase | Proseso | Taon | Mga Telepono |
|---|---|---|---|---|
| Apple A20 Pro | flagship | 2 nm | 2026* | 2 |
| Apple A19 | flagship | 3 nm | 2025* | 2 |
| Apple A19 Pro | flagship | 3 nm | 2025 | 3 |
| Apple A18 | flagship | 3 nm | 2024* | 2 |
| Apple A18 Pro | flagship | 3 nm | 2024* | 2 |
Mga chipset ng Samsung 5
| Chipset | Klase | Proseso | Taon | Mga Telepono |
|---|---|---|---|---|
| Exynos 1480 | mid-range | 4 nm | 2026* | 1 |
| Exynos 1610 | entry-level | — | 2026* | 1 |
| Exynos 1680 | upper mid-range | 4 nm | 2026* | 1 |
| Exynos 2500 | flagship | 3 nm | 2026* | 1 |
| Exynos 2600 for Galaxy · SM8850 | flagship | 3 nm | 2026* | 1 |
Mga chipset ng Huawei 4
| Chipset | Klase | Proseso | Taon | Mga Telepono |
|---|---|---|---|---|
| Kirin 8020 | upper mid-range | 7 nm | 2026* | 1 |
| Kirin 9010S | upper mid-range | 7 nm | 2026* | 1 |
| Kirin 9035 | flagship | 5 nm | 2026 | 1 |
| Kirin T93 / Kirin T93A | not yet classed | — | 2026* | 1 |
Mga chipset ng Google 3
* Taon ng unang telepono sa LexzyTech Specs na may chip na iyon (ang sariling taon ng pagluncod nito ay hindi nailathala ng aming mga pinagkukunan). Ang mga klasipikasyon ay aming pagtataya mula sa disenyo ng bawat chip, hindi ang mga score ng benchmark.
Mabilis na sagot
Anong chipset ng telepono ang pinakagamit sa LexzyTech Specs?
Ang Dimensity 6300 ni MediaTek, sa 11 na telepono.
Anong mga gumagawa ng chipset ang tinutugunan?
MediaTek (28), Qualcomm (21), Unisoc (12), Apple (5), Samsung (5), Huawei (4) at Google (3).
Paano ang mga klasipikasyon ng chipset?
Flagship, upper mid-range, mid-range o entry-level, mula sa aming 1-5 na rating kung saan rating namin ang chip, kung hindi aming pagtataya mula sa disenyo nito (mga core, bilis ng clock, graphics). Hindi sila mga score ng benchmark.