- Vipimo
- Chipseti
Chipsets za simu
LexzyTech Specs inajumuisha chipsets za simu 78 kutoka kwa watengenezaji 7 (MediaTek, Qualcomm, Unisoc, Apple, Samsung, Huawei na Google), zinazotumika katika simu 168. Iliyotumika zaidi ni Dimensity 6300, katika simu 11. Chipset mpya zaidi ya bendera hapa ni Kirin 9035. Kukurasa wa kila chipset hueleza uwezo wake, inachoweza kuendesha vyema na kile ambacho simu zenye chipset hiyo hutoa.
Chipsets za MediaTek 28
| Chipseti | Daraja | Mchakato | Mwaka | Simu |
|---|---|---|---|---|
| Dimensity 6360 Max | kiwango cha kati | 6 nm | 2026* | 1 |
| Dimensity 6400 | kiwango cha kati | 6 nm | 2026* | 1 |
| Dimensity 7100 | kiwango cha kati | 6 nm | 2026* | 3 |
| Dimensity 7300 Elite | kiwango cha kati | 4 nm | 2026* | 1 |
| Dimensity 7360 Max | kiwango cha kati | 4 nm | 2026* | 1 |
| Dimensity 7400 Elite | kiwango cha kati | 4 nm | 2026* | 2 |
| Dimensity 7400 Ultimate | kiwango cha kati | 4 nm | 2026* | 1 |
| Dimensity 7400 Ultra | kiwango cha kati | 4 nm | 2026* | 1 |
| Dimensity 7450X | kiwango cha kati | 4 nm | 2026* | 1 |
| Dimensity 9400+ | bendera | 3 nm | 2026* | 1 |
| Dimensity 9500 | bendera | 3 nm | 2026* | 1 |
| Dimensity 9600 Pro | bendera | 2 nm | 2026* | 2 |
| Dimensity 9600M | bendera | 3 nm | 2026* | 2 |
| Helio G100 | kiwango cha kati | 6 nm | 2026* | 3 |
| Helio G200 | kiwango cha kati | 6 nm | 2026* | 2 |
| Helio G200 Ultimate | kiwango cha kati | 6 nm | 2026* | 1 |
| MTK Dimensity 7025 | kiwango cha kati | 6 nm | 2026* | 1 |
| Dimensity 6300 | kiwango cha kati | 6 nm | 2025* | 11 |
| Dimensity 8300 | bendera | 4 nm | 2025* | 2 |
| Helio G100 Ultimate | kiwango cha kati | 6 nm | 2025* | 3 |
| Helio G81 | kiwango cha kuanzia | 12 nm | 2025* | 3 |
| Dimensity 6100+ | kiwango cha kati | 6 nm | 2024* | 1 |
| Helio G91 | kiwango cha kuanzia | 12 nm | 2024* | 1 |
| Dimensity 7050 | kiwango cha kati | 6 nm | 2023* | 3 |
| Helio G36 | kiwango cha kuanzia | 12 nm | 2023* | 1 |
| Helio G99 | kiwango cha kati | 6 nm | 2023* | 5 |
| Helio G85 · MT6768 | kiwango cha kuanzia | 12 nm | 2020 | 3 |
| Helio P22 · MT6762 | kiwango cha kuanzia | 12 nm | 2019* | 1 |
Chipsets za Qualcomm 21
| Chipseti | Daraja | Mchakato | Mwaka | Simu |
|---|---|---|---|---|
| QCM6690 | bado haijawekwa daraja | 4 nm | 2026* | 1 |
| Snapdragon 6 Gen 4 | bado haijawekwa daraja | 4 nm | 2026* | 1 |
| Snapdragon 6 Gen 5 · SM6850 | kiwango cha juu cha kati | 4 nm | 2026* | 3 |
| Snapdragon 6s Gen 2 · SM4450-AF | kiwango cha kati | 4 nm | 2026* | 1 |
| Snapdragon 6s Gen 3 | kiwango cha kati | 6 nm | 2026* | 1 |
| Snapdragon 6s Gen 4 · SM6435-AA | kiwango cha kati | 4 nm | 2026* | 3 |
| Snapdragon 8 Elite Extreme Gen 6 · SM8975 | bendera | 2 nm | 2026* | 3 |
| Snapdragon 8 Elite Gen 5 for Galaxy · SM8850 | bendera | 3 nm | 2026* | 2 |
| Snapdragon 8 Elite Gen 6 | bendera | 2 nm | 2026* | 1 |
| Snapdragon 8 Gen 5 · SM8845 | bendera | 3 nm | 2026* | 1 |
| Snapdragon 4 Gen 2 · SM4450 | kiwango cha kati | 4 nm | 2025* | 1 |
| Snapdragon 6 Gen 3 · SM6475-AB | kiwango cha kati | 4 nm | 2025* | 3 |
| Snapdragon 7 Gen 3 · SM7550 | kiwango cha kati | 4 nm | 2025* | 2 |
| Snapdragon 7 Gen 4 · SM7750-AB | kiwango cha juu cha kati | 4 nm | 2025* | 5 |
| Snapdragon 7s Gen 3 · SM7635 | kiwango cha kati | 4 nm | 2025* | 3 |
| Snapdragon 7s Gen 4 · SM7635 | kiwango cha kati | 4 nm | 2025* | 3 |
| Snapdragon 8 Elite for Galaxy | bendera | 3 nm | 2025 | 1 |
| Snapdragon 8 Elite Gen 5 · SM8850-AC | bendera | 3 nm | 2025* | 10 |
| Snapdragon 8 Gen 3 · SM8650-AB | bendera | 4 nm | 2025* | 1 |
| Snapdragon 8s Gen 4 | bendera | 4 nm | 2025 | 4 |
| Snapdragon 8 Elite | bendera | 3 nm | 2024 | 5 |
Chipsets za Unisoc 12
| Chipseti | Daraja | Mchakato | Mwaka | Simu |
|---|---|---|---|---|
| Unisoc SC9863A | kiwango cha kuanzia | 22 nm | 2026* | 3 |
| Unisoc T610 | kiwango cha kuanzia | 12 nm | 2026* | 2 |
| Unisoc T616 | kiwango cha kuanzia | 12 nm | 2026* | 1 |
| Unisoc T7100 | bado haijawekwa daraja | — | 2026* | 3 |
| Unisoc T7300 | kiwango cha kati | 6 nm | 2026* | 1 |
| Unisoc T8200 | kiwango cha kati | 6 nm | 2026* | 3 |
| Unisoc T8300 | kiwango cha kati | 6 nm | 2026* | 1 |
| Unisoc T615 | kiwango cha kuanzia | 12 nm | 2025* | 3 |
| Unisoc T620 | kiwango cha kati | 12 nm | 2025* | 3 |
| Unisoc T7200 | kiwango cha kuanzia | 12 nm | 2025* | 1 |
| Unisoc T7250 | kiwango cha kuanzia | 12 nm | 2025* | 3 |
| Unisoc T606 | kiwango cha kuanzia | 12 nm | 2022* | 2 |
Chipsets za Apple 5
| Chipseti | Daraja | Mchakato | Mwaka | Simu |
|---|---|---|---|---|
| Apple A20 Pro | bendera | 2 nm | 2026* | 2 |
| Apple A19 | bendera | 3 nm | 2025* | 2 |
| Apple A19 Pro | bendera | 3 nm | 2025 | 3 |
| Apple A18 | bendera | 3 nm | 2024* | 2 |
| Apple A18 Pro | bendera | 3 nm | 2024* | 2 |
Chipsets za Samsung 5
| Chipseti | Daraja | Mchakato | Mwaka | Simu |
|---|---|---|---|---|
| Exynos 1480 | kiwango cha kati | 4 nm | 2026* | 1 |
| Exynos 1610 | kiwango cha kuanzia | — | 2026* | 1 |
| Exynos 1680 | kiwango cha juu cha kati | 4 nm | 2026* | 1 |
| Exynos 2500 | bendera | 3 nm | 2026* | 1 |
| Exynos 2600 for Galaxy · SM8850 | bendera | 3 nm | 2026* | 1 |
Chipsets za Huawei 4
| Chipseti | Daraja | Mchakato | Mwaka | Simu |
|---|---|---|---|---|
| Kirin 8020 | kiwango cha juu cha kati | 7 nm | 2026* | 1 |
| Kirin 9010S | kiwango cha juu cha kati | 7 nm | 2026* | 1 |
| Kirin 9035 | bendera | 5 nm | 2026 | 1 |
| Kirin T93 / Kirin T93A | bado haijawekwa daraja | — | 2026* | 1 |
Chipsets za Google 3
* Mwaka wa simu ya kwanza kwenye LexzyTech Specs yenye chip hiyo (mwaka wake wa uzinduzi haujachapishwa na vyanzo vyetu). Madaraja ni makadirio yetu kutoka kwa muundo wa kila chip, si alama za majaribio.
Majibu ya haraka
Ni chipset gani ya simu inayotumika zaidi kwenye LexzyTech Specs?
Dimensity 6300 ya MediaTek, katika simu 11.
Ni watengenezaji gani wa chipsets wanaojumuishwa?
MediaTek (28), Qualcomm (21), Unisoc (12), Apple (5), Samsung (5), Huawei (4) na Google (3).
Chipsets zinawekwa vipi madaraja?
Bendera, kiwango cha juu cha kati, kiwango cha kati au kiwango cha kuanzia, kutoka kwa ukadiriaji wetu wa 1-5 ambapo tulikadiria chip, vinginevyo ni makadirio yetu kutoka kwa muundo wake (cores, kasi ya saa, michoro). Hizi si alama za majaribio.